JPH02101598U - - Google Patents
Info
- Publication number
- JPH02101598U JPH02101598U JP762889U JP762889U JPH02101598U JP H02101598 U JPH02101598 U JP H02101598U JP 762889 U JP762889 U JP 762889U JP 762889 U JP762889 U JP 762889U JP H02101598 U JPH02101598 U JP H02101598U
- Authority
- JP
- Japan
- Prior art keywords
- conductive metal
- laminated material
- laminated
- highly conductive
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 6
- 239000002648 laminated material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP762889U JPH02101598U (en]) | 1989-01-27 | 1989-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP762889U JPH02101598U (en]) | 1989-01-27 | 1989-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101598U true JPH02101598U (en]) | 1990-08-13 |
Family
ID=31212799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP762889U Pending JPH02101598U (en]) | 1989-01-27 | 1989-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101598U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020148796A1 (ja) * | 2019-01-15 | 2020-07-23 | 株式会社日立ハイテク | 電磁界遮蔽板、その製造方法、電磁界遮蔽構造、および半導体製造環境 |
-
1989
- 1989-01-27 JP JP762889U patent/JPH02101598U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020148796A1 (ja) * | 2019-01-15 | 2020-07-23 | 株式会社日立ハイテク | 電磁界遮蔽板、その製造方法、電磁界遮蔽構造、および半導体製造環境 |
| KR20210072092A (ko) * | 2019-01-15 | 2021-06-16 | 주식회사 히타치하이테크 | 전자계 차폐판, 그 제조 방법, 전자계 차폐 구조 및 반도체 제조 환경 |
| JPWO2020148796A1 (ja) * | 2019-01-15 | 2021-10-14 | 株式会社日立ハイテク | 電磁界遮蔽板、その製造方法、電磁界遮蔽構造、および半導体製造環境 |
| US20220007556A1 (en) | 2019-01-15 | 2022-01-06 | Hitachi High-Tech Corporation | Electromagnetic Field Shielding Plate, Method for Manufacturing Same, Electromagnetic Field Shielding Structure, and Semiconductor Manufacturing Environment |
| US11690208B2 (en) | 2019-01-15 | 2023-06-27 | Hitachi High-Tech Corporation | Electromagnetic field shielding plate, method for manufacturing same, electromagnetic field shielding structure, and semiconductor manufacturing environment |
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